CarbonX ezPC Polycarbonate 3D Printer Filament by 3DXTech Made in USA 750g

3DXTech ezPC Polycarbonate Filament — 1.75mm, 750g, Tg 118°C / HDT 112°C, No Enclosure Required, AMS Compatible, No-Odor Engineering PC, Made in USA

3DXTech ezPC Polycarbonate is the polycarbonate filament engineered for the real world — not the industrial oven. Where standard polycarbonate requires a heated chamber, extreme temperatures, and extensive bed preparation, ezPC was formulated specifically to print on a wide array of open-frame desktop printers without a heated chamber, without hazardous fumes, and without the warping behavior that makes conventional PC impractical outside of professional enclosures. The result is a material that sits precisely between the commodity tier (PLA, PETG, ABS, ASA) and the ultra-performance tier (Ultem, PEEK) — delivering Tg of 118°C and HDT of 112°C, outstanding impact resistance, and low warpage, at a price and printability level that puts true engineering-grade PC within reach on any capable FDM machine. Manufactured in 3DXTech's 68,000 ft² facility in Grand Rapids, Michigan. ISO 9001:2015 certified.

⚠️ No cooling fan. Run 0% part cooling fan throughout the entire print. Fan cooling causes PC to warp and delaminate — this is the single most common cause of ezPC print failures.
⚠️ Dry before printing: 80°C for 4+ hours. Polycarbonate is highly hygroscopic. Moisture causes bubbling, stringing, and poor layer adhesion. Use a filament dryer or oven and keep the spool in a dry box while printing.
⚠️ All-metal hotend required — 255–275°C exceeds the safe operating range of PTFE-lined hotends. Verify your hotend is all-metal before your first print.
⚠️ Adhesive recommended on print bed. Despite ezPC's improved adhesion vs. standard PC, a thin layer of adhesive (glue stick, Magigoo PC, or equivalent) on a PEI or glass surface is strongly recommended to prevent warping on large prints.
✅ No enclosure required — ezPC's low-warp formulation prints successfully on open-frame printers where standard PC would fail.
✅ 750g spool fits Bambu AMS, Creality CFS, and Anycubic ACE Pro for multi-material setups.

Tg 118°C / HDT 112°C — Where This Sits in the Material Hierarchy

The two numbers that define ezPC's thermal ceiling are glass transition temperature (Tg) of 118°C and heat deflection temperature (HDT) of 112°C. To put this in practical context: standard PLA begins deforming around 55–60°C. PETG around 70–80°C. ABS around 95–100°C. ASA around 95–100°C. ezPC holds its geometry at 112°C under load — covering automotive interior temperatures, industrial enclosures, outdoor electronics housings, and any environment where the materials below it on this list have failed. This is not a theoretical spec: it is the operating range that makes polycarbonate the default choice for automotive lighting, riot shields, and aircraft interior panels in injection-molded form, now accessible in an FDM-printable formulation that doesn't require a $10,000 industrial printer to run.

ezPC delivers ABS-surpassing thermal performance without ABS's enclosure requirement and styrene fume output — making it the correct upgrade path for home and office environments where ABS is impractical but PLA/PETG are thermally insufficient.

Low Warp + No Enclosure — Why ezPC Prints Differently From Standard PC

Standard polycarbonate's printability problems are well-documented: extreme warping, layer delamination, stringent enclosure and temperature requirements, and sensitivity to any deviation from optimal settings. ezPC addresses these at the formulation level — the polymer was developed specifically for 3D printing, not adapted from an injection molding grade. The result is a PC that prints successfully on open-frame printers at 255–275°C hotend / 90–110°C bed with no enclosure required and no hazardous fumes. The key operational difference from standard PC: no part cooling fan. PC requires slow, controlled cooling to maintain layer adhesion — any forced airflow from a part cooling fan causes warping and delamination. Zero fan, every layer.

AquaTek X1 USM Water-Soluble Support Compatibility

ezPC adheres exceptionally well to 3DXTech AquaTek X1 USM water-soluble support filament, enabling dual-extrusion prints with complex overhangs, internal channels, and interlocking geometry that would be impossible or impractical to support with breakaway materials. AquaTek X1 dissolves in warm water and is bio-safe for home or office drain disposal — making support removal for engineering-grade PC parts as simple as a water soak.

Print Settings

Who Is This For?

ezPC is the correct material when your functional parts are operating in thermal or mechanical conditions that PLA, PETG, ABS, or ASA cannot sustain — and you don't want or need the complexity of Ultem or PEEK. Specific applications where ezPC outperforms every commodity filament: automotive interior brackets and housings that see direct sunlight through glass (80–110°C surface temperatures), outdoor electronics enclosures in summer climates, industrial tooling jigs in heated environments, sterilizable medical device prototypes, electrical components near heat sources, and any structural part that has previously failed from heat deformation in a vehicle or warm enclosure. If you've been tolerating ABS to get heat resistance and fighting the enclosure and fume requirements — ezPC gives you better thermal performance on an open-frame printer with no hazardous fumes.

Technical Documents

• Download Technical Data Sheet (TDS) — ezPC Polycarbonate
• Download Safety Data Sheet (SDS) — ezPC Polycarbonate
• 3DXTech Slicer Profiles on GitHub — community-maintained profiles by printer model

Browse all engineering-grade filaments at 3D Printer Filament.